LG Electronics announced that it has been accepted into the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner, positioning its cooling technologies for AI‑focused data centres.

The partnership underscores the growing need for efficient thermal management in AI‑driven facilities, where rising heat loads demand advanced cooling solutions.

LG’s portfolio includes liquid‑cooling units that can be integrated early in data‑centre design, providing a clear framework for cooling system layout and supporting infrastructure.

Among the qualified products, LG’s 2.6‑megawatt Coolant Distribution Unit (CDU) has earned NVIDIA DSX Ready status, currently offering the largest cooling capacity among the network’s DSX Ready CDU partners.

The company has also secured NVIDIA qualification for 600‑kilowatt and 1‑megawatt CDUs, meeting stringent criteria for cooling performance, failover capability and reliability.

LG’s liquid‑cooling approach uses direct‑to‑chip (DTC) technology that delivers coolant straight to CPUs, GPUs and other heat‑generating components, working alongside existing air‑cooling to form a hybrid system.

Qualified CDUs will be displayed at Data Centre World Asia 2026 in Singapore, scheduled for 29–30 September at Marina Bay Sands.

LG plans to seek NVIDIA qualification for its upcoming 4.0‑megawatt CDU model before the end of the year, expanding its liquid‑cooling portfolio for next‑generation AI data centres.

James Lee, president of LG ES Company, said the partnership is a pivotal step in supporting the global AI ecosystem and that collaboration with NVIDIA will help shape future data‑centre cooling standards.